Electronic component

ABSTRACT

An electronic component includes a capacitor having a desired capacitance value and a laminate including a plurality of laminated insulating material layers. Land electrodes are provided on a bottom surface of the laminate. Internal conductors face the land electrodes, respectively, across the insulating material layer within the laminate, have areas larger than those of the land electrodes, respectively, and contain the land electrodes, respectively, when seen in a planar view from a z-axis direction. A capacitor conductor is provided on the positive direction side of the capacitor conductors in the z-axis direction and faces the capacitor conductors.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an electronic component, and morespecifically, relates to an electronic component that includes alaminate including a plurality of laminated insulating material layers.

2. Description of the Related Art

As an existing electronic component, for example, a surface-mountedcomponent described in Japanese Unexamined Patent ApplicationPublication No. 2003-68569 is known. FIG. 11 is a cross-sectionalstructure diagram of an electronic device 500 that includes asurface-mounted component 510 described in Japanese Unexamined PatentApplication Publication No. 2003-68569.

The electronic device 500 in FIG. 11 includes the surface-mountedcomponent 510 and a mother substrate 523. The surface-mounted component510 includes a module substrate 521, a land conductor 522, and aninternal electrode 526. The module substrate 521 has a laminationstructure including a conductor and a non-conductor. The land conductor522 is provided on a bottom surface of the module substrate 521. Theinternal electrode 526 is provided within the module substrate 521 andfaces the land conductor 522 across the non-conductor. The mothersubstrate 523 includes a corresponding electrode 524 and is a substrateon which the surface-mounted component 510 is mounted. The correspondingelectrode 524 is provided on a top surface of the mother substrate 523.In the electronic device 500, the land conductor 522 and thecorresponding electrode 524 are connected to each other by solder or thelike, whereby the surface-mounted component 510 is mounted on the mothersubstrate 523.

In the surface-mounted component 510 as described above, the landconductor 522 and the internal electrode 526 face each other, therebyconstituting a capacitor. Thus, a circuit within the module substrate521 and the mother substrate 523 are electrically connected to eachother via the capacitor.

However, the surface-mounted component 510 has a problem that it isdifficult to have a desired capacitance value at the capacitor includingthe land conductor 522 and the internal electrode 526 as describedbelow. More specifically, the land conductor 522 and the internalelectrode 526 face each other so as to coincide with each other whenseen in a planar view from the upper side. Thus, if the position wherethe land conductor 522 or the internal electrode 526 is printed shiftseven slightly, the area of the portion where the land conductor 522 andthe internal electrode 526 face each other is changed. As a result, thecapacitance value of the capacitor including the land conductor 522 andthe internal electrode 526 is changed.

SUMMARY OF THE INVENTION

Therefore, preferred embodiments of the present invention provide anelectronic component that includes a capacitor having a desiredcapacitance value.

An electronic component according to an aspect of a preferred embodimentof the present invention includes a laminate including a plurality oflaminated insulating material layers; a land electrode provided on abottom surface of the laminate; a first capacitor conductor facing theland electrode across the insulating material layer within the laminate,having an area larger than that of the land electrode, and containingthe land electrode when seen in a planar view from a laminationdirection; and a second capacitor conductor provided on an upper side ofthe first capacitor conductor in the lamination direction and facing thefirst capacitor conductor.

According to a preferred embodiment of the present invention, even whena lamination shift occurs during a laminating process, an electroniccomponent that includes a capacitor having a desired capacitance valuecan be obtained.

The above and other elements, features, steps, characteristics andadvantages of the present invention will become more apparent from thefollowing detailed description of the preferred embodiments withreference to the attached drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is an external perspective view of an electronic componentaccording to a first preferred embodiment of the present invention.

FIG. 2 is an exploded perspective view of the electronic componentaccording to the first preferred embodiment of the present invention.

FIG. 3 is an equivalent circuit diagram of the electronic componentaccording to the first preferred embodiment of the present invention.

FIG. 4 is an exploded perspective view of an electronic componentaccording to a second preferred embodiment of the present invention.

FIG. 5 is an equivalent circuit diagram of the electronic componentaccording to the second preferred embodiment of the present invention.

FIG. 6 is a diagram in which insulating material layers are laminated.

FIG. 7 is a graph showing an experimental result.

FIG. 8 is a diagram in which insulating material layers are laminated.

FIG. 9 is an exploded perspective view of an electronic componentaccording to a third preferred embodiment of the present invention.

FIG. 10 is an equivalent circuit diagram of the electronic componentaccording to the third preferred embodiment of the present invention.

FIG. 11 is a cross-sectional structure diagram of an electronic deviceincluding a surface-mounted component described in Japanese UnexaminedPatent Application Publication No. 2003-68569.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, an electronic component according to preferred embodimentsof the present invention will be described with reference to thedrawings.

First preferred Embodiment

Hereinafter, the configuration of an electronic component according to afirst preferred embodiment of the present invention will be describedwith reference to the drawings. FIG. 1 is an external perspective viewof the electronic component 10 according to the first preferredembodiment of the present invention. FIG. 2 is an exploded perspectiveview of the electronic component 10 according to the first preferredembodiment of the present invention. FIG. 3 is an equivalent circuitdiagram of the electronic component 10 according to the first preferredembodiment of the present invention. Hereinafter, a lamination directionof the electronic component 10 is defined as a z-axis direction. Inaddition, when the electronic component 10 is seen in a planar view fromthe z-axis direction, a direction along the long sides of the electroniccomponent 10 is defined as an x-axis direction, and a direction alongthe short sides of the electronic component 10 is defined as a y-axisdirection.

As shown in FIGS. 1 and 2, the electronic component 10 includes alaminate 12, land electrodes 14 (14 a to 14 c), internal conductors 18(18 a to 18 m), a ground conductor 19, and via-hole conductors b (b1 tob41).

As shown in FIG. 2, the laminate 12 includes a plurality of laminatedrectangular insulating material layers 16 (16 a to 16 i) and has arectangular parallelepiped shape. Each insulating material layer 16 hasa rectangular or substantially rectangular shape and is preferablyformed from, for example, a Ba—Al—Si ceramic dielectric material. Theinsulating material layers 16 a to 16 i are laminated in order from thepositive direction side to the negative direction side in the z-axisdirection. Hereinafter, the principal surface of each insulatingmaterial layer 16 on the positive direction side in the z-axis directionis referred to as a front surface, and the principal surface of eachinsulating material layer 16 on the negative direction side in thez-axis direction is referred to as a back surface.

The land electrodes 14 a to 14 c are provided on the back surface of theinsulating material layer 16 i (the bottom surface of the laminate 12)and each have a rectangular or substantially rectangular shape extendingin the y-axis direction. In other words, the electronic component 10 hasa so-called LGA (Land Grid Array) structure. It should be noted that foreasy understanding, in FIG. 2, the land electrodes 14 a to 14 c areshown in a state where the land electrodes 14 a to 14 c are separatedfrom the back surface of the insulating material layer 16 i. The landelectrodes 14 a to 14 c are aligned in order from the negative directionside to the positive direction side in the x-axis direction. The landelectrode 14 a is used as an input terminal. The land electrode 14 b isused as a ground terminal. The land electrode 14 c is used as an outputterminal.

The internal conductors 18 and the ground conductor 19 are preferablyformed from a conductive material containing Cu as a principal componentand are provided on the front surfaces of the insulating material layers16. The via-hole conductors b are formed preferably by filling via holesextending through the insulating material layers 16 in the z-axisdirection with a conductive material containing Cu as a principalcomponent. The land electrodes 14, the internal conductors 18, theground conductor 19, and the via-hole conductors b constitute coils Ls1to Ls3 and capacitors Cs1 to Cs3, Cm1, Cm2, and Cp1 (see FIG. 3)included in the laminate 12 as described below.

As shown in FIGS. 2 and 3, the coil Ls1 includes the internal conductors18 a and 18 d and the via-hole conductors b1 to b3 and b8 to b13. Morespecifically, the internal conductors 18 a and 18 d are provided on thefront surfaces of the insulating material layers 16 b and 16 c,respectively, and each have an L shape extending in the y-axis directionand bending at an end on the positive direction side in the y-axisdirection to the positive direction side in the x-axis direction. Theinternal conductor 18 a and the internal conductor 18 d preferably havethe same shape and overlap each other so as to coincide with each otherwhen seen in a planar view from the z-axis direction. In addition, thevia-hole conductor b1 extends through the insulating material layer 16 bin the z-axis direction and connects an end of the internal conductor 18a to an end of the internal conductor 18 d. The via-hole conductor b8extends through the insulating material layer 16 b in the z-axisdirection and connects another end of the internal conductor 18 a toanother end of the internal conductor 18 d. Thus, the internalconductors 18 a and 18 d are connected to each other.

The via-hole conductors b2 and b3 extend through the insulating materiallayers 16 c and 16 d, respectively, in the z-axis direction. Thevia-hole conductors b2 and b3 are connected in series, therebyconstituting a single via-hole conductor. The end of the via-holeconductor b2 on the positive direction side in the z-axis direction isconnected to the end of the internal conductor 18 d. The end of thevia-hole conductor b3 on the negative direction side in the z-axisdirection is connected to an end of the internal conductor 18 h.

The via-hole conductors b9 to b13 extend through the insulating materiallayers 16 c to 16 g in the z-axis direction. The via-hole conductors b9to b13 are connected in series, thereby constituting a single via-holeconductor. The end of the via-hole conductor b9 on the positivedirection side in the z-axis direction is connected to the other end ofthe internal conductor 18 d.

As described above, the coil Ls1 preferably is a loop coil having asubstantially U shape when seen in a planar view from the positivedirection side in the x-axis direction.

The internal conductor 18 l is provided on the front surface of theinsulating material layer 16 i and has a rectangular or substantiallyrectangular shape extending in the y-axis direction. The internalconductor 18 l faces the land electrode 14 a across the insulatingmaterial layer 16 i within the laminate 12, has an area larger than thatof the land electrode 14 a, and contains the land electrode 14 a whenseen from the positive direction side in the z-axis direction (thelamination direction).

The capacitor Cs1 preferably includes the internal conductors 18 h and18 l and the ground conductor 19. The internal conductor 18 h isprovided on the front surface of the insulating material layer 16 e andhas a T shape including a portion extending in the y-axis direction anda portion projecting from the center of the portion in the y-axisdirection toward the positive direction side in the x-axis direction.The ground conductor 19 is provided on the insulating material layer 16h and has a cross shape. The ground conductor 19 is provided on thenegative direction side of the internal conductor 18 h in the z-axisdirection (on the lower side thereof in the lamination direction) and onthe positive direction side of the internal conductor 18 l in the z-axisdirection (on the upper side thereof in the lamination direction). Theinternal conductor 18 h and the ground conductor 19 face each otheracross the insulating material layers 16 e, 16 f, and 16 g, and theinternal conductor 18 l and the ground conductor 19 face each otheracross the insulating material layer 16 h. Thus, the capacitor Cs1 isprovided between the internal conductors 18 h and 18 l and the groundconductor 19.

The via-hole conductors b4 to b7 extend through the insulating materiallayers 16 e to 16 h in the z-axis direction. The via-hole conductors b4to b7 are connected in series, thereby constituting a single via-holeconductor. The end of the via-hole conductor b4 on the positivedirection side in the z-axis direction is connected to the end of thevia-hole conductor b3 on the negative direction side in the z-axisdirection. The end of the via-hole conductor b7 on the negativedirection side in the z-axis direction is connected to the internalconductor 181. In addition, the end of the via-hole conductor b13 on thenegative direction side in the z-axis direction is connected to theground conductor 19. Thus, the coil Ls1 and the capacitor Cs1 areconnected in parallel, thereby constituting an LC parallel resonatorLC1.

In addition, the via-hole conductor b14 extends through the insulatingmaterial layer 16 i in the z-axis direction. The end of the via-holeconductor b14 on the positive direction side in the z-axis direction isconnected to the internal conductor 18 l. The end of the via-holeconductor b14 on the negative direction side in the z-axis direction isconnected to the land electrode 14 a. Thus, the LC parallel resonatorLC1 including the coil Ls1 and the capacitor Cs1 is connected to theland electrode 14 a via the via-hole conductor b14.

In addition, the via-hole conductors b15 and b16 extend through theinsulating material layers 16 h and 16 i in the z-axis direction. Thevia-hole conductors b15 and b16 are connected in series, therebyconstituting a single via-hole conductor. The end of the via-holeconductor b15 on the positive direction side in the z-axis direction isconnected to the ground conductor 19. The end of the via-hole conductorb16 on the negative direction side is connected to the land electrode 14b. Thus, the LC parallel resonator LC1 including the coil Ls1 and thecapacitor Cs1 is connected to the land electrode 14 b via the via-holeconductors b15 and b16.

As shown in FIGS. 2 and 3, the coil Ls2 including the internalconductors 18 b and 18 e and the via-hole conductors b31 to b34 and b36to b41. More specifically, the internal conductors 18 b and 18 e areprovided on the front surfaces of the insulating material layers 16 band 16 c and on the positive direction sides of the internal conductors18 a and 18 d in the x-axis direction, respectively and each have arectangular or substantially rectangular shape extending in the y-axisdirection. The internal conductor 18 b and the internal conductor 18 epreferably have the same shape and overlap each other so as to coincidewith each other when seen in a planar view from the z-axis direction. Inaddition, the via-hole conductor b31 extends through the insulatingmaterial layer 16 b in the z-axis direction and connects an end of theinternal conductor 18 b to an end of the internal conductor 18 e. Thevia-hole conductor b36 extends through the insulating material layer 16b in the z-axis direction and connects another end of the internalconductor 18 b to another end of the internal conductor 18 e. Thus, theinternal conductors 18 b and 18 e are connected to each other.

The via-hole conductors b32 to b34 extend through the insulatingmaterial layers 16 c to 16 e, respectively, in the z-axis direction. Thevia-hole conductors b32 to b34 are connected in series, therebyconstituting a single via-hole conductor. The end of the via-holeconductor b32 on the positive direction side in the z-axis direction isconnected to the end of the internal conductor 18 e.

The via-hole conductors b37 to b41 extend through the insulatingmaterial layers 16 c to 16 g in the z-axis direction. The via-holeconductors b37 to b41 are connected in series, thereby constituting asingle via-hole conductor. The end of the via-hole conductor b37 on thepositive direction side in the z-axis direction is connected to theother end of the internal conductor 18 e.

As described above, the coil Ls2 preferably is a loop coil having asubstantially U shape when seen in a planar view from the positivedirection side in the x-axis direction.

The capacitor Cs2 preferably includes the internal conductors 18 j and18 k and the ground conductor 19. The internal conductors 18 j and 18 kare provided on the front surfaces of the insulating material layers 16f and 16 g, respectively and each have a rectangular or substantiallyrectangular shape. The via-hole conductor b35 extends through theinsulating material layer 16 f in the z-axis direction. The end of thevia-hole conductor b35 on the positive direction side in the z-axisdirection is connected to the internal conductor 18 j. The end of thevia-hole conductor b35 on the negative direction side in the z-axisdirection is connected to the internal conductor 18 k. The internalconductor 18 j and the ground conductor 19 face each other across theinsulating material layers 16 f and 16 g. The internal conductor 18 kand the ground conductor 19 face each other across the insulatingmaterial layer 16 g. Thus, the capacitor Cs2 is provided between theinternal conductors 18 j and 18 k and the ground conductor 19.

The end of the via-hole conductor b34 on the negative direction side inthe z-axis direction is connected to the internal conductor 18 j. Inaddition, the end of the via-hole conductor b41 on the negativedirection side in the z-axis direction is connected to the groundconductor 19. Thus, the coil Ls2 and the capacitor Cs2 are connected inparallel, thereby constituting an LC parallel resonator LC2. Inaddition, the LC parallel resonator LC2 including the coil Ls2 and thecapacitor Cs2 is connected to the land electrode 14 b via the via-holeconductors b15 and b16.

As shown in FIGS. 2 and 3, the coil Ls3 preferably includes the internalconductors 18 c and 18 f and the via-hole conductors b17 to b19 and b24to b29. More specifically, the internal conductors 18 c and 18 f areprovided on the front surfaces of the insulating material layers 16 band 16 c, respectively, and each have an L shape extending in the y-axisdirection and bending at an end on the positive direction side in they-axis direction to the negative direction side in the x-axis direction.The internal conductor 18 c and the internal conductor 18 f have thesame shape and overlap each other so as to coincide with each other whenseen in a planar view from the z-axis direction. In addition, thevia-hole conductor b17 extends through the insulating material layer 16b in the z-axis direction and connects an end of the internal conductor18 c to an end of the internal conductor 18 f. The via-hole conductorb24 extends through the insulating material layer 16 b in the z-axisdirection and connects another end of the internal conductor 18 c toanother end of the internal conductor 18 f. Thus, the internalconductors 18 c and 18 f are connected to each other.

The via-hole conductors b18 and b19 extend through the insulatingmaterial layers 16 c and 16 d, respectively, in the z-axis direction.The via-hole conductors b18 and b19 are connected in series, therebyconstituting a single via-hole conductor. The end of the via-holeconductor b18 on the positive direction side in the z-axis direction isconnected to the end of the internal conductor 18 f. The end of thevia-hole conductor b19 on the negative direction side in the z-axisdirection is connected to the end of the internal conductor 18 i.

The via-hole conductors b25 to b29 extend through the insulatingmaterial layers 16 c to 16 g in the z-axis direction. The via-holeconductors b25 to b29 are connected in series, thereby constituting asingle via-hole conductor. The end of the via-hole conductor b25 on thepositive direction side in the z-axis direction is connected to theother end of the internal conductor 18 f.

As described above, the coil Ls3 preferably is a loop coil having asubstantially U shape when seen in a planar view from the positivedirection side in the x-axis direction.

The internal conductor 18 m is provided on the front surface of theinsulating material layer 16 i and has a rectangular or substantiallyrectangular shape extending in the y-axis direction. The internalconductor 18 m faces the land electrode 14 c across the insulatingmaterial layer 16 i within the laminate 12, has an area larger than thatof the land electrode 14 c, and contains the land electrode 14 c whenseen from the positive direction side in the z-axis direction (thelamination direction).

The capacitor Cs3 preferably includes the internal conductors 18 i and18 m and the ground conductor 19. The internal conductor 18 i isprovided on the front surface of the insulating material layer 16 e andhas a T shape including a portion extending in the y-axis direction anda portion projecting from the center of the portion in the y-axisdirection toward the negative direction side in the x-axis direction.The ground conductor 19 is provided on the negative direction side ofthe internal conductor 18 i in the z-axis direction (on the lower sidethereof in the lamination direction) and on the positive direction sideof the internal conductor 18 m in the z-axis direction (on the upperside thereof in the lamination direction). The internal conductor 18 iand the ground conductor face each other across the insulating materiallayers 16 e, 16 f, and 16 g, and the internal conductor 18 m and theground conductor 19 face each other across the insulating material layer16 h. Thus, the capacitor Cs3 is provided between the internalconductors 18 i and 18 m and the ground conductor 19.

The via-hole conductors b20 to b23 extend through the insulatingmaterial layers 16 e to 16 h in the z-axis direction. The via-holeconductors b20 to b23 are connected in series, thereby constituting asingle via-hole conductor. The end of the via-hole conductor b20 on thepositive direction side in the z-axis direction is connected to the endof the via-hole conductor b19 on the negative direction side in thez-axis direction. The end of the via-hole conductor b23 on the negativedirection side in the z-axis direction is connected to the internalconductor 18 m. In addition, the end of the via-hole conductor b29 onthe negative direction side in the z-axis direction is connected to theground conductor 19. Thus, the coil Ls3 and the capacitor Cs3 areconnected in parallel, thereby constituting an LC parallel resonatorLC3.

In addition, the via-hole conductor b30 extends through the insulatingmaterial layer 16 i in the z-axis direction. The end of the via-holeconductor b30 on the positive direction side in the z-axis direction isconnected to the internal conductor 18 m. The end of the via-holeconductor b30 on the negative direction side in the z-axis direction isconnected to the land electrode 14 c. Thus, the LC parallel resonatorLC3 including the coil Ls3 and the capacitor Cs3 is connected to theland electrode 14 c via the via-hole conductor b30. In addition, the LCparallel resonator LC3 including the coil Ls3 and the capacitor Cs3 isconnected to the land electrode 14 b via the via-hole conductors b15 andb16.

The capacitor Cm1 including the internal conductor 18 h and the internalconductor 18 j. The internal conductor 18 h and the internal conductor18 j face each other across the insulating material layer 16 e. Thus,the capacitor Cm1 is provided between the internal conductors 18 h and18 j.

The capacitor Cm2 preferably includes the internal conductor 18 i andthe internal conductor 18 j. The internal conductor 18 i and theinternal conductor 18 j face each other across the insulating materiallayer 16 e. Thus, the capacitor Cm2 is provided between the internalconductors 18 i and 18 j.

The capacitor Cp1 preferably includes the internal conductor 18 g andthe internal conductors 18 h and 18 i. The internal conductor 18 g isprovided on the front surface of the insulating material layer 16 d andhas a rectangular or substantially rectangular shape extending in thex-axis direction. The internal conductor 18 g and the internalconductors 18 h and 18 i face each other across the insulating materiallayer 16 d. Thus, two capacitors are provided between the internalconductors 18 h and 18 g and between the internal conductors 18 g and 18i. These two capacitors are connected in series, thereby constitutingthe capacitor Cp1.

The electronic component 10 configured as described above is used as,for example, a band-pass filter. More specifically, the impedances ofthe LC parallel resonators LC1 to LC3 become maximum at their resonantfrequencies. Thus, the LC parallel resonators LC1 to LC3 do not passhigh-frequency signals having frequencies around their resonantfrequencies. In other words, high-frequency signals having frequenciesaround the resonant frequencies of the LC parallel resonators LC1 to LC3do not flow from the external electrode 14 a to the external electrode14 b and flow from the external electrode 14 a to the external electrode14 c. On the other hand, the impedances of the LC parallel resonatorsLC1 to LC3 are relatively low at frequencies other than the frequenciesaround the resonant frequencies of the LC parallel resonators LC1 toLC3. Thus, the frequencies other than the frequencies around theresonant frequencies of the LC parallel resonators LC1 to LC3 passthrough the LC parallel resonators LC1 to LC3 and flow to the ground viathe external electrode 14 b. As described above, the electroniccomponent 10 serves as a band-pass filter that passes onlyhigh-frequency signals having frequencies around the resonantfrequencies of the LC parallel resonators LC1 to LC3.

In the electronic component 10, desired capacitance values can beobtained at the capacitors Cs1 and Cs3 having desired capacitancevalues. More specifically, the internal conductors 18 l and 18 m facethe land electrodes 14 a and 14 c, respectively, across the insulatingmaterial layer 16 i within the laminate 12, have areas larger than thoseof the land electrodes 14 a and 14 c, respectively, and contain the landelectrodes 14 a and 14 c, respectively, when seen from the positivedirection side in the z-axis direction (the lamination direction). Thus,even when the positions where the internal conductors 18 l, 18 m, 18 h,and 18 i constituting the capacitors Cs1 and Cs3 or the land electrodes14 a and 14 c are printed shift slightly, a state is kept in which theland electrodes 14 a and 14 c are contained in the internal conductors18 l and 18 m when seen in a planar view from the z-axis direction.Thus, in the electronic component 10, formation of capacitances due tothe land electrodes 14 a and 14 c protruding from the internalconductors 18 l and 18 m to face the ground electrode 19 issignificantly reduced and prevented. Therefore, deviation of thecapacitors Cs1 and Cs3 from the desired capacitance values issignificantly reduced and prevented.

In addition, in the electronic component 10, even when the capacitorsCs1 and Cs3 having desired capacitance values are obtained, insulationbetween the land electrodes 14 a to 14 c can be kept. More specifically,when the areas of the land electrodes 14 a and 14 c are increased inorder to obtain desired capacitance values, the intervals between theland electrodes 14 a to 14 c decrease. Meanwhile, when the electroniccomponent 10 is mounted on a substrate, the land electrodes 14 a to 14 care connected to lands on the substrate by means of solder. Thus, whenthe intervals between the land electrodes 14 a to 14 c decrease, thereis the possibility that the land electrodes 14 a to 14 c are connectedto each other via solder when being mounted by means of solder. In otherwords, the insulation between the land electrodes 14 a to 14 c is notkept.

Thus, in the electronic component 10, the areas of the internalconductors 18 l and 18 m are larger than the areas of the landelectrodes 14 a and 14 c. Since the internal conductors 18 l and 18 mare included in the electronic component 10, the internal conductors 18l and 18 m are not mounted via solder like the land electrodes 14 a to14 c. Thus, when the electronic component 10 is mounted onto asubstrate, there is no possibility that a short circuit occurs betweenthe internal conductors 18 l and 18 m. Thus, it is easy to make theinternal conductors 18 l and 18 m close to each other as compared to theland electrodes 14 a to 14 c. In other words, it is easy to make theinternal conductors 18 l and 18 m large in size as compared to the landelectrodes 14 a to 14 c. Due to the above, in the electronic component10, even when the capacitors Cs1 and Cs3 having desired capacitancevalues are obtained, the insulation between the land electrodes 14 a to14 c can be kept.

Second Preferred Embodiment

Hereinafter, the configuration of an electronic component 10 a accordingto a second preferred embodiment will be described with reference to thedrawings. FIG. 4 is an exploded perspective view of the electroniccomponent 10 a according to the second preferred embodiment. FIG. 5 isan equivalent circuit diagram of the electronic component 10 a accordingto the second preferred embodiment. It should be noted that for anexternal perspective view of the electronic component 10 a, FIG. 1 isused. It should be noted that among the elements of the electroniccomponent 10 a, the same elements as those of the electronic component10 are designated by the same reference signs.

As shown in FIG. 4, the electronic component 10 a includes a laminate12, land electrodes 14 (14 a to 14 c), internal conductors 18 (18 a to18 g, 18 l, and 18 m) and 38 (38 a to 38 h), ground conductors 39 (39 aand 39 b), and via-hole conductors b (b51 to b97).

As shown in FIG. 4, the laminate 12 includes a plurality of laminatedrectangular insulating material layers 16 (16 a to 16 j) and preferablyhas a rectangular or substantially rectangular parallelepiped shape.Each insulating material layer 16 has a rectangular or substantiallyrectangular shape and is formed from, for example, a Ba—Al—Si ceramicdielectric material. The insulating material layers 16 a to 16 j arelaminated in order from the positive direction side to the negativedirection side in the z-axis direction. Hereinafter, the principalsurface of each insulating material layer 16 on the positive directionside in the z-axis direction is referred to as a front surface, and theprincipal surface of each insulating material layer 16 on the negativedirection side in the z-axis direction is referred to as a back surface.

The land electrodes 14 a to 14 c are provided on the back surface of theinsulating material layer 16 j (the bottom surface of the laminate 12)and each have a rectangular or substantially rectangular shape extendingin the y-axis direction. In other words, the electronic component 10 ahas a so-called LGA (Land Grid Array) structure. It should be noted thatfor easy understanding, in FIG. 4, the land electrodes 14 a to 14 c areshown in a state where the land electrodes 14 a to 14 c are separatedfrom the back surface of the insulating material layer 16 j. The landelectrodes 14 a to 14 c are aligned in order from the negative directionside to the positive direction side in the x-axis direction. The landelectrode 14 a is used as an input terminal. The land electrode 14 b isused as a ground terminal. The land electrode 14 c is used as an outputterminal.

The internal conductors 18 and 38 and the ground conductors 39 arepreferably made of a conductive material containing Cu as a principalcomponent and are provided on the front surfaces of the insulatingmaterial layers 16. The via-hole conductors b are formed preferably byfilling via holes extending through the insulating material layers 16 inthe z-axis direction with a conductive material containing Cu as aprincipal component. The land electrodes 14, the internal conductors 18and 38, the ground conductors 39, and the via-hole conductors bconstitute coils Ls1 to Ls3 and capacitors Cs1 to Cs3, Cm1, Cm2, and Cp1(see FIG. 5) included in the laminate 12 as described below.

As shown in FIGS. 4 and 5, the coil Ls1 includes the internal conductors18 a and 18 d and the via-hole conductors b51 to b53 and b57 to b61.More specifically, the internal conductors 18 a and 18 d are provided onthe front surfaces of the insulating material layers 16 b and 16 c,respectively, and each have an L shape extending in the y-axis directionand bending at an end on the positive direction side in the y-axisdirection to the positive direction side in the x-axis direction. Theinternal conductor 18 a and the internal conductor 18 d preferably havethe same shape and overlap each other so as to coincide with each otherwhen seen in a planar view from the z-axis direction. In addition, thevia-hole conductor b51 extends through the insulating material layer 16b in the z-axis direction and connects an end of the internal conductor18 a to an end of the internal conductor 18 d. The via-hole conductorb57 extends through the insulating material layer 16 b in the z-axisdirection and connects another end of the internal conductor 18 a toanother end of the internal conductor 18 d. Thus, the internalconductors 18 a and 18 d are connected to each other.

The via-hole conductors b52 and b53 extend through the insulatingmaterial layers 16 c and 16 d, respectively, in the z-axis direction.The via-hole conductors b52 and b53 are connected in series, therebyconstituting a single via-hole conductor. The end of the via-holeconductor b52 on the positive direction side in the z-axis direction isconnected to the end of the internal conductor 18 d.

The via-hole conductors b58 to b61 extend through the insulatingmaterial layers 16 c to 16 f in the z-axis direction. The via-holeconductors b58 to b61 are connected in series, thereby constituting asingle via-hole conductor. The end of the via-hole conductor b58 on thepositive direction side in the z-axis direction is connected to theother end of the internal conductor 18 d.

As described above, the coil Ls1 preferably is a loop coil having asubstantially U shape when seen in a planar view from the positivedirection side in the x-axis direction.

The internal conductor 18 l is provided on the front surface of theinsulating material layer 16 j and has a rectangular or substantiallyrectangular shape extending in the y-axis direction. The internalconductor 18 l faces the land electrode 14 a across the insulatingmaterial layer 16 j within the laminate 12, has an area larger than thatof the land electrode 14 a, and contains the land electrode 14 a whenseen from the positive direction side in the z-axis direction (thelamination direction). No conductor layer is provided between theinternal conductor 18 l and the land electrode 14 a.

The capacitor Cs1 preferably includes the internal conductors 18 l, 38c, and 38 f and the ground conductors 39 a and 39 b. The internalconductors 38 c and 38 f are provided on the front surfaces of theinsulating material layers 16 f and 16 h, respectively, and each have arectangular or substantially rectangular shape extending in the y-axisdirection. The ground conductor 39 a is provided on the front surface ofthe insulating material layer 16 g and has a T shape including a portionextending in the x-axis direction and a portion projecting from thecenter of the portion in the x-axis direction toward the negativedirection side in the y-axis direction. The ground conductor 39 b isprovided on the front surface of the insulating material layer 16 i andhas a rectangular or substantially rectangular or substantiallyrectangular shape. It should be noted that the ground conductor 39 b isprovided with a cut A1 recessed from the side (outer rim) on thenegative direction side in the x-axis direction toward the positivedirection side in the x-axis direction and a cut A2 recessed from theside (outer rim) on the positive direction side in the x-axis directiontoward the negative direction side in the x-axis direction.

Here, the shapes of the cuts A1 and A2 in the electronic component 10 awill be described with reference to the drawing. FIG. 6 is a diagram inwhich the insulating material layers 16 h to 16 j are laminated. Itshould be noted that for easy understanding, the internal conductor 38 gis omitted.

The depths D1 and D2 of the cuts A1 and A2 in the x-axis direction arelarger than the widths D3 and D4, respectively, in the x-axis direction,of the portions of the internal conductors 18 l, 18 m, 38 f, and 38 hthat overlap the cuts A1 and A2.

Furthermore, the ground conductor 39 b is provided on the positivedirection side of the internal conductor 18 l in the z-axis direction(on the upper side thereof in the lamination direction). In addition,the internal conductor 38 f is provided on the positive direction sideof the ground conductor 39 b in the z-axis direction (on the upper sidethereof in the lamination direction). Thus, the internal conductor 18 land the ground conductor 39 b face each other across the insulatingmaterial layer 16 i. Similarly, the internal conductor 38 f and theground conductor 39 b face each other across the insulating materiallayer 16 h. In other words, capacitances are provided between theinternal conductors 18 l and 38 f and the ground conductor 39 b,respectively.

Furthermore, the ground conductor 39 a is provided on the positivedirection side of the internal conductor 38 f in the z-axis direction(on the upper side thereof in the lamination direction). In addition,the internal conductor 38 c is provided on the positive direction sideof the ground conductor 39 a in the z-axis direction (on the upper sidethereof in the lamination direction). Thus, the internal conductor 38 fand the ground conductor 39 a face each other across the insulatingmaterial layer 16 g. Similarly, the internal conductor 38 c and theground conductor 39 a face each other across the insulating materiallayer 16 f. In other words, capacitances are provided between theinternal conductors 38 c and 38 f and the ground conductor 39 a,respectively.

In addition, the via-hole conductors b54 to b56 extend through theinsulating material layers 16 e to 16 g in the z-axis direction. Thevia-hole conductors b54 to b56 are connected in series, therebyconstituting a single via-hole conductor. The end of the via-holeconductor b54 on the positive direction side in the z-axis direction isconnected to the end of the via-hole conductor b53 on the negativedirection side in the z-axis direction. The end of the via-holeconductor b54 on the negative direction side in the z-axis direction isconnected to the internal conductor 38 c. The end of the via-holeconductor b56 on the negative direction side in the z-axis direction isconnected to the internal conductor 38 f.

In addition, the via-hole conductors b64 and b65 extend through theinsulating material layers 16 h and 16 i in the z-axis direction. Thevia-hole conductors b64 and b65 are connected in series, therebyconstituting a single via-hole conductor. The via-hole conductors b64and b65 extend through the inside of the cut A1. The end of the via-holeconductor b64 on the positive direction side in the z-axis direction isconnected to the internal conductor 38 f. The end of the via-holeconductor b65 on the negative direction side in the z-axis direction isconnected to the internal conductor 18 l. In other words, the via-holeconductors b64 and b65 connect the internal conductor 18 l to theinternal conductor 38 f.

Since the internal conductors 18 l, 38 c, and 38 f are connected asdescribed above, four capacitors including the internal conductors 18 l,38 c, and 38 f and the ground conductors 39 a and 39 b are connected. Bythe four capacitors, the capacitor Cs1 is provided.

In addition, as described above, the end of the via-hole conductor b65on the negative direction side in the z-axis direction is connected tothe internal conductor 18 l. Furthermore, the via-hole conductors b62and b63 extend through the insulating material layers 16 g and 16 h inthe z-axis direction. The via-hole conductors b62 and b63 are connectedin series, thereby constituting a single via-hole conductor. The end ofthe via-hole conductor b62 on the positive direction side in the z-axisdirection is connected to the end of the via-hole conductor b61 on thenegative direction side in the z-axis direction. The end of the via-holeconductor b63 on the negative direction side in the z-axis direction isconnected to the ground conductor 39 b. Thus, the coil Ls1 and thecapacitor Cs1 are connected in parallel, thereby constituting an LCparallel resonator LC1.

In addition, the via-hole conductor b66 extends through the insulatingmaterial layer 16 j in the z-axis direction. The end of the via-holeconductor b66 on the positive direction side in the z-axis direction isconnected to the internal conductor 18 l. The end of the via-holeconductor b66 on the negative direction side in the z-axis direction isconnected to the land electrode 14 a. Thus, the LC parallel resonatorLC1 including the coil Ls1 and the capacitor Cs1 is connected to theland electrode 14 a via the via-hole conductor b66.

In addition, the via-hole conductors b67 and b68 extend through theinsulating material layers 16 i and 16 j in the z-axis direction. Thevia-hole conductors b67 and b68 are connected in series, therebyconstituting a single via-hole conductor. The end of the via-holeconductor b67 on the positive direction side in the z-axis direction isconnected to the ground conductor 39 b. The end of the via-holeconductor b68 on the negative direction side in the z-axis direction isconnected to the land electrode 14 b. Thus, the LC parallel resonatorLC1 including the coil Ls1 and the capacitor Cs1 is connected to theland electrode 14 b via the via-hole conductors b67 and b68.

As shown in FIGS. 4 and 5, the coil Ls2 preferably includes the internalconductors 18 b and 18 e and the via-hole conductors b85 to b88 and b91to b95. More specifically, the internal conductors 18 b and 18 e areprovided on the front surfaces of the insulating material layers 16 band 16 c and on the positive direction sides of the internal conductors18 a and 18 d in the x-axis direction, respectively, and each have arectangular or substantially rectangular or substantially rectangularshape extending in the y-axis direction. The internal conductor 18 b andthe internal conductor 18 e have the same shape and overlap each otherso as to coincide with each other when seen in a planar view from thez-axis direction. In addition, the via-hole conductor b85 extendsthrough the insulating material layer 16 b in the z-axis direction andconnects an end of the internal conductor 18 b to an end of the internalconductor 18 e. The via-hole conductor b91 extends through theinsulating material layer 16 b in the z-axis direction and connectsanother end of the internal conductor 18 b to another end of theinternal conductor 18 e. Thus, the internal conductors 18 b and 18 e areconnected in parallel.

The via-hole conductors b86 to b88 extend through the insulatingmaterial layers 16 c to 16 e, respectively, in the z-axis direction. Thevia-hole conductors b86 to b88 are connected in series, therebyconstituting a single via-hole conductor. The end of the via-holeconductor b86 on the positive direction side in the z-axis direction isconnected to the end of the internal conductor 18 e.

The via-hole conductors b92 to b95 extend through the insulatingmaterial layers 16 c to 16 f in the z-axis direction. The via-holeconductors b92 to b95 are connected in series, thereby constituting asingle via-hole conductor. The end of the via-hole conductor b92 on thepositive direction side in the z-axis direction is connected to theother end of the internal conductor 18 e.

As described above, the coil Ls2 preferably is a loop coil having asubstantially U shape when seen in a planar view from the positivedirection side in the x-axis direction.

The capacitor Cs2 preferably includes the internal conductors 38 d and38 g and the ground conductors 39 a and 39 b. The internal conductors 38d and 38 g are provided on the front surfaces of the insulating materiallayers 16 f and 16 h, respectively and each preferably have a T shape,for example. The via-hole conductors b89 and b90 extend through theinsulating material layers 16 f and 16 g in the z-axis direction. Thevia-hole conductors b89 and b90 are connected in series, therebyconstituting a single via-hole conductor. The end of the via-holeconductor b89 on the positive direction side in the z-axis direction isconnected to the internal conductor 38 d. The end of the via-holeconductor b90 on the negative direction side in the z-axis direction isconnected to the internal conductor 38 g. The internal conductors 38 dand 38 g and the ground conductor 39 a face each other across theinsulating material layers 16 f and 16 g. The internal conductor 38 gand the ground conductor 39 b face each other across the insulatingmaterial layer 16 h. Thus, the capacitor Cs2 is provided between theinternal conductors 38 d and 38 g and the ground conductors 39 a and 39b.

The end of the via-hole conductor b88 on the negative direction side inthe z-axis direction is connected to the internal conductor 38 d. Inaddition, the end of the via-hole conductor b95 on the negativedirection side in the z-axis direction is connected to the groundconductor 39 a. Furthermore, the via-hole conductors b96 and b97 extendthrough the insulating material layers 16 g and 16 h in the z-axisdirection. The via-hole conductors b96 and b97 are connected in series,thereby constituting a single via-hole conductor. The end of thevia-hole conductor b96 on the positive direction side in the z-axisdirection is connected to the ground conductor 39 a. The end of thevia-hole conductor b97 on the negative direction side in the z-axisdirection is connected to the ground conductor 39 b. Thus, the coil Ls2and the capacitor Cs2 are connected in parallel, thereby constituting anLC parallel resonator LC2. In addition, the LC parallel resonator LC2including the coil Ls2 and the capacitor Cs2 is connected to the landelectrode 14 b via the via-hole conductors b67 and b68.

As shown in FIGS. 4 and 5, the coil Ls3 preferably includes the internalconductors 18 c and 18 f and the via-hole conductors b69 to b71 and b75to b79. More specifically, the internal conductors 18 c and 18 f areprovided on the front surfaces of the insulating material layers 16 band 16 c, respectively, and each have an L shape extending in the y-axisdirection and bending at an end on the positive direction side in they-axis direction to the negative direction side in the x-axis direction.The internal conductor 18 c and the internal conductor 18 f have thesame shape and overlap each other so as to coincide with each other whenseen in a planar view from the z-axis direction. In addition, thevia-hole conductor b69 extends through the insulating material layer 16b in the z-axis direction and connects an end of the internal conductor18 c to an end of the internal conductor 18 f. The via-hole conductorb75 extends through the insulating material layer 16 b in the z-axisdirection and connects another end of the internal conductor 18 c toanother end of the internal conductor 18 f. Thus, the internalconductors 18 c and 18 f are connected to each other.

The via-hole conductors b70 and b71 extend through the insulatingmaterial layers 16 c and 16 d, respectively, in the z-axis direction.The via-hole conductors b70 and b71 are connected in series, therebyconstituting a single via-hole conductor. The end of the via-holeconductor b70 on the positive direction side in the z-axis direction isconnected to the end of the internal conductor 18 f.

The via-hole conductors b76 to b79 extend through the insulatingmaterial layers 16 c to 16 f in the z-axis direction. The via-holeconductors b76 to b79 are connected in series, thereby constituting asingle via-hole conductor. The end of the via-hole conductor b76 on thepositive direction side in the z-axis direction is connected to theother end of the internal conductor 18 f.

As described above, the coil Ls3 preferably is loop coil having asubstantially U shape when seen in a planar view from the positivedirection side in the x-axis direction.

The internal conductor 18 m is provided on the front surface of theinsulating material layer 16 j and has a rectangular or substantiallyrectangular shape extending in the y-axis direction. The internalconductor 18 m faces the land electrode 14 c across the insulatingmaterial layer 16 j within the laminate 12, has an area larger than thatof the land electrode 14 c, and contains the land electrode 14 c whenseen from the positive direction side in the z-axis direction (thelamination direction). No conductor layer is provided between theinternal conductor 18 m and the land electrode 14 c.

The capacitor Cs3 preferably includes the internal conductors 18 m, 38e, and 38 h and the ground conductors 39 a and 39 b. The internalconductors 38 e and 38 h are provided on the front surfaces of theinsulating material layers 16 f and 16 h, respectively, and each have arectangular or substantially rectangular shape extending in the y-axisdirection.

Furthermore, the ground conductor 39 b is provided on the positivedirection side of the internal conductor 18 m in the z-axis direction(on the upper side thereof in the lamination direction). In addition,the internal conductor 38 h is provided on the positive direction sideof the ground conductor 39 b in the z-axis direction (on the upper sidethereof in the lamination direction). Thus, the internal conductor 18 mand the ground conductor 39 b face each other across the insulatingmaterial layer 16 i. Similarly, the internal conductor 38 h and theground conductor 39 b face each other across the insulating materiallayer 16 h. In other words, capacitances are provided between theinternal conductors 18 m and 28 h and the ground conductor 39 b,respectively.

Furthermore, the ground conductor 39 a is provided on the positivedirection side of the internal conductor 38 h in the z-axis direction(on the upper side thereof in the lamination direction). In addition,the internal conductor 38 e is provided on the positive direction sideof the ground conductor 39 a in the z-axis direction (on the upper sidethereof in the lamination direction). Thus, the internal conductor 38 hand the ground conductor 39 a face each other across the insulatingmaterial layer 16 g. Similarly, the internal conductor 38 e and theground conductor 39 a face each other across the insulating materiallayer 16 f. In other words, capacitances are provided between theinternal conductors 38 e and 38 h and the ground conductor 39 a,respectively.

In addition, the via-hole conductors b72 to b74 extend through theinsulating material layers 16 e to 16 g in the z-axis direction. Thevia-hole conductors b72 to b74 are connected in series, therebyconstituting a single via-hole conductor. The end of the via-holeconductor b72 on the positive direction side in the z-axis direction isconnected to the end of the via-hole conductor b71 on the negativedirection side. The end of the via-hole conductor b72 on the negativedirection side in the z-axis direction is connected to the internalconductor 38 e. The end of the via-hole conductor b74 on the negativedirection side in the z-axis direction is connected to the internalconductor 38 h.

In addition, the via-hole conductors b82 and b83 extend through theinsulating material layers 16 h and 16 i in the z-axis direction. Thevia-hole conductors b82 and b83 are connected in series, therebyconstituting a single via-hole conductor. The via-hole conductors b82and b83 extend through the inside of the cut A2. The end of the via-holeconductor b82 on the positive direction side in the z-axis direction isconnected to the internal conductor 38 h. The end of the via-holeconductor b83 on the negative direction side in the z-axis direction isconnected to the internal conductor 18 m. In other words, the via-holeconductors b82 and b83 connect the internal conductor 18 m to theinternal conductor 38 h.

Since the internal conductors 18 m, 38 e, and 38 h are connected asdescribed above, four capacitors including the internal conductors 18 m,38 e, and 38 h and the ground conductors 39 a and 39 b are preferablyconnected, for example. By the four capacitances, the capacitor Cs3 isprovided.

In addition, as described above, the end of the via-hole conductor b83on the negative direction side in the z-axis direction is connected tothe internal conductor 18 m. Furthermore, the via-hole conductors b80and b81 extend through the insulating material layers 16 g and 16 h inthe z-axis direction. The via-hole conductors b80 and b81 are connectedin series, thereby constituting a single via-hole conductor. The end ofthe via-hole conductor b80 on the positive direction side in the z-axisdirection is connected to the end of the via-hole conductor b79 on thenegative direction side in the z-axis direction. The end of the via-holeconductor b81 on the negative direction side in the z-axis direction isconnected to the ground conductor 39 b. Thus, the coil Ls3 and thecapacitor Cs3 are connected in parallel, thereby constituting an LCparallel resonator LC3.

In addition, the via-hole conductor b84 extends through the insulatingmaterial layer 16 j in the z-axis direction. The end of the via-holeconductor b84 on the positive direction side in the z-axis direction isconnected to the internal conductor 18 m. The end of the via-holeconductor b84 on the negative direction side in the z-axis direction isconnected to the land electrode 14 c. Thus, the LC parallel resonatorLC3 including the coil Ls3 and the capacitor Cs3 is connected to theland electrode 14 c via the via-hole conductor b84.

In addition, the via-hole conductors b67 and b68 extend through theinsulating material layers 16 i and 16 j in the z-axis direction. Thevia-hole conductors b67 and b68 are connected in series, therebyconstituting a single via-hole conductor. The end of the via-holeconductor b67 on the positive direction side in the z-axis direction isconnected to the ground conductor 39 b. The end of the via-holeconductor b68 on the negative direction side is connected to the landelectrode 14 b. Thus, the LC parallel resonator LC3 including the coilLs3 and the capacitor Cs3 is connected to the land electrode 14 b viathe via-hole conductors b67 and b68.

The capacitor Cm1 preferably includes the internal conductor 38 a andthe internal conductor 38 d. The internal conductor 38 a is provided onthe front surface of the insulating material layer 16 e and has an Lshape extending in the y-axis direction and bending at an end on thepositive direction side in the y-axis direction to the positivedirection side in the x-axis direction. In addition, the internalconductor 38 a is connected to the via-hole conductors b53 and b54. Asdescribed above, the internal conductor 38 d is provided on the frontsurface of the insulating material layer 16 f and has a T shape. Inaddition, the internal conductor 38 d is connected to the via-holeconductors b88 and b89. The internal conductor 38 a and the internalconductor 38 d face each other across the insulating material layer 16e. Thus, the capacitor Cm1 is provided between the internal conductor 38a and 38 d.

The capacitor Cm2 preferably includes the internal conductor 38 b andthe internal conductor 38 d. The internal conductor 38 b is provided onthe front surface of the insulating material layer 16 e and has an Lshape extending in the y-axis direction and bending at an end on thepositive direction side in the y-axis direction to the negativedirection side in the x-axis direction. In addition, the internalconductor 38 b is connected to the via-hole conductors b71 and b72. Asdescribed above, the internal conductor 38 d is provided on the frontsurface of the insulating material layer 16 f and has a T shape. Theinternal conductor 38 b and the internal conductor 38 d face each otheracross the insulating material layer 16 e. Thus, the capacitor Cm2 isprovided between the internal conductors 38 b and 38 d.

The capacitor Cp1 preferably includes the internal conductor 18 g andthe internal conductors 38 a and 38 b. The internal conductor 18 g isprovided on the front surface of the insulating material layer 16 d andhas a rectangular or substantially rectangular shape extending in thex-axis direction. The internal conductor 18 g and the internalconductors 38 a and 38 b face each other across the insulating materiallayer 16 d. Thus, two capacitors are formed between the internalconductor 38 a and 18 g and between the internal conductors 18 g and 38b. These two capacitors are connected in series, thereby constitutingthe capacitor Cp1.

The electronic component 10 a configured as described above is alsopreferably used as, for example, a band-pass filter. It should be notedthat the operation of the electronic component 10 a is the same as theoperation of the electronic component 10, and thus the descriptionthereof is omitted.

In the electronic component 10 a, similarly to the electronic component10, desired capacitance values can be obtained at the capacitors Cs1 andCs3 having desired capacitance values. Furthermore, in the electroniccomponent 10 a, similarly to the electronic component 10, even when thecapacitors Cs1 and Cs3 having desired capacitance values are obtained,insulation between the land electrodes 14 a to 14 c can be maintained.

In addition, according to the electronic component 10 a, even when theinsulating material layers 16 h to 16 j shift in the x-axis direction inlaminating the insulating material layers 16 h to 16 j, the capacitancevalues of the capacitors Cs1 and Cs3 are unlikely to vary. Morespecifically, as shown in FIG. 6, the depths D1 and D2 of the cuts A1and A2 in the x-axis direction are larger than the widths D3 and D4,respectively, in the x-axis direction, of the portions of the internalconductors 18 l, 18 m, 38 f, and 38 h that overlaps the cuts A1 and A2.Thus, even when the insulating material layers 16 h to 16 j shiftslightly in the x-axis direction, the areas of the portions where theinternal conductors 18 l, 18 m, 38 f, and 38 h and the ground conductor39 b face each other do not change. As a result, according to theelectronic component 10 a, even when the insulating material layers 16 hto 16 j shift in the x-axis direction in laminating the insulatingmaterial layers 16 h to 16 j, the capacitance values of the capacitorsCs1 and Cs3 are unlikely to vary.

In order to demonstrate that variations of the capacitance values of thecapacitors Cs1 and Cs3 can be significantly reduced and prevented, theinventor of the preferred embodiments of the present invention describedand claimed in the present application conducted an experiment describedbelow. Specifically, the electronic component 10 a was produced as afirst sample, and an electronic component in which the cuts A1 and A2are not provided was produced as a second sample. The configurationother than the cuts A1 and A2 in the second sample is the same as thatin the first sample. The relationship between frequency and insertionloss was checked using the first sample and the second sample. FIG. 7 isa graph showing the experimental result. The vertical axis indicatesinsertion loss, and the horizontal axis indicates frequency.

According to FIG. 7, it appears that in the second sample, in thepassband of high-frequency signals, the insertion loss is greater thanthat in the first sample. This is thought to be because in the secondsample, a lamination shift occurs and the capacitance values of thecapacitors Cs1 and Cs3 are decreased. Thus, according to the electroniccomponent 10 a, it is recognized that the capacitance values of thecapacitors Cs1 and Cs3 are unlikely to vary.

In addition, in the electronic component 10 a, variations of thecapacitance values of the capacitors Cs1 to Cs3 can be significantlyreduced and prevented. More specifically, each of the capacitors Cs1 toCs3 preferably includes a plurality of parallel-connected capacitorsdefined by a plurality of the internal conductors 18 and 38 and aplurality of the ground conductors 39. Thus, the capacitance values ofthe plurality of capacitors constituting each of the capacitors Cs1 toCs3 are relatively small. Therefore, even when the capacitance value ofone capacitor among the plurality of capacitors varies due to alamination shift or the like, the variation amounts of the capacitancevalues of the capacitors Cs1 to Cs3 are relatively small. Thus, in theelectronic component 10 a, variations of the capacitance values of thecapacitors Cs1 to Cs3 can be significantly reduced and prevented.

MODIFIED EXAMPLE

Hereinafter, internal conductors 18′l, 18′m, 38′f, and 38′h and a groundconductor 39′b according to a modified example of a preferred embodimentof the present invention will be described with reference to thedrawing. FIG. 8 is a diagram in which insulating material layers 16 h to16 j are laminated.

As shown in FIG. 8, the depths D1 and D2 of the cuts A1 and A2 in thex-axis direction are larger than the widths D3 and D4, respectively, inthe x-axis direction, of the portions of the internal conductors 18′l,18′m, 38′f, and 38′h that overlap the cuts A1 and A2. It should be notedthat the widths D3 and D4, in the x-axis direction, of the portions ofthe internal conductors 18′l, 18′m, 38′f, and 38′h that overlap the cutsA1 and A2 are smaller than the widths D5 and D6, in the x-axisdirection, of the other portions of the internal conductors 18′l, 18′m,38′f, and 38′h. Thus, the depths D1 and D2 of the cuts A1 and A2 in thex-axis direction can be decreased.

Third Preferred Embodiment

Hereinafter, the configuration of an electronic component 10 b accordingto a third preferred embodiment will be described with reference to thedrawings. FIG. 9 is an exploded perspective view of the electroniccomponent 10 b according to the third preferred embodiment. FIG. 10 isan equivalent circuit diagram of the electronic component 10 b accordingto the third preferred embodiment. It should be noted that for anexternal perspective view of the electronic component 10 b, FIG. 1 isused. In addition, among the elements of the electronic component 10 b,the same elements as those of the electronic component 10 are designatedby the same reference signs.

The difference between the electronic component 10 b and the electroniccomponent 10 is the presence/absence of the via-hole conductors b14 andb30. More specifically, as shown in FIG. 9, in the electronic component10 b, no via-hole conductor is provided between a land electrode 14 aand an internal electrode 18 l. Thus, the land electrode 14 a and theinternal electrode 18 l face each other across an insulating materiallayer 16 i in a state of being insulated from each other. Therefore, acapacitor Cx1 is provided between the land electrode 14 a and theinternal electrode 18 l. In addition, no via-hole conductor is providedbetween a land electrode 14 c and an internal electrode 18 m. Thus, theland electrode 14 c and the internal electrode 18 m face each otheracross the insulating material layer 16 i in a state of being insulatedfrom each other. Therefore, a capacitor Cx2 is provided between the landelectrode 14 c and the internal electrode 18 m.

The electronic component 10 b configured as described above ispreferably used as, for example, a band-pass filter. It should be notedthat the operation of the electronic component 10 b is the same as theoperation of the electronic component 10, and thus the descriptionthereof is omitted.

In the electronic component 10 b, similarly to the electronic component10, desired capacitance values can be obtained at the capacitors Cs1 andCs3.

In addition, according to the electronic component 10 b, even when theland electrodes 14 a and 14 c slightly shift in printing the landelectrodes 14 a and 14 c, the capacitance values of the capacitors Cx1and Cx2 are unlikely to vary. More specifically, the internal conductors18 l and 18 m face the land electrodes 14 a and 14 c, respectively,across the insulating material layer 16 i within the laminate 12, haveareas larger than those of the land electrodes 14 a and 14 c,respectively, and contain the land electrodes 14 a and 14 c,respectively, when seen from the positive direction side in the z-axisdirection (the lamination direction). Therefore, even when the internalconductors 18 l and 18 m or the land electrodes 14 a and 14 cconstituting the capacitors Cx1 and Cx2 slightly shift, the areas of theportions where the internal conductors 18 l and 18 m face the landelectrodes 14 a and 14 c do not change. As a result, in the electroniccomponent 10 b, even when the land electrodes 14 a and 14 c slightlyshift in printing the land electrodes 14 a and 14 c, the capacitancevalues of the capacitors Cx1 and Cx2 are unlikely to vary.

Furthermore, according to the electronic component 10 b, even when thepositions where the land electrodes 14 a and 14 c are printed slightlyshift, a state is kept in which the land electrodes 14 a and 14 c arecontained in the internal conductors 18 l and 18 m when seen in a planarview from the z-axis direction. Because of this, in the electroniccomponent 10, formation of capacitances due to the land electrodes 14 aand 14 c protruding from the internal conductors 18 l and 18 m to facethe ground electrode 19 is significantly reduced and prevented.Therefore, deviation of the capacitors Cx1 and Cx2 from the desiredcapacitance values is significantly reduced and prevented, and change ofthe characteristics of the electronic component 10 b due to anunnecessary capacitance can be prevented.

As described above, preferred embodiments of the present invention areuseful for electronic components, and in particular, are excellent inthat a capacitor having a desired capacitance value can be obtained.

While preferred embodiments of the present invention have been describedabove, it is to be understood that variations and modifications will beapparent to those skilled in the art without departing from the scopeand spirit of the present invention. The scope of the present invention,therefore, is to be determined solely by the following claims.

What is claimed is:
 1. An electronic component comprising: a laminateincluding a plurality of insulating layers laminated on each other in alamination direction; a land electrode provided at a lower portion ofthe laminate; a first capacitor conductor facing the land electrode witha first of the insulating layers disposed between the first capacitorconductor and the land electrode; a second capacitor conductor providedabove the first capacitor conductor in the lamination direction andfacing the first capacitor conductor with a second of the insulatinglayers disposed between the second capacitor conductor and the firstcapacitor conductor; a third capacitor conductor provided above thesecond capacitor conductor in the lamination direction and facing thesecond capacitor conductor with a third of the insulating layersdisposed between the third capacitor conductor and the second capacitorconductor; and a first via-hole conductor connecting the first capacitorconductor to the third capacitor conductor; wherein an area where thefirst capacitor conductor and the third capacitor conductor overlap eachother in the lamination direction overlaps a first portion of the secondof the insulating layers that contains the second capacitor conductorand a second portion of the second of the insulating layers that doesnot contain the second capacitor conductor; the first via-hole conductorextends through the second portion of the second of the insulatinglayers that does not contain the second capacitor conductor; a dimensionof the second of the insulating layers extends from an outer edge of thesecond of the insulating layers to an edge of the second capacitorconductor, extends completely across the third capacitor conductor, andextends in a first direction; and the dimension is larger than a widthextending in the first direction of the third capacitor conductor andsmaller than a width extending in the first direction of a portion ofthe second capacitor conductor disposed adjacent to the second portionof the second of the insulating layers in the first direction.
 2. Theelectronic component according to claim 1, wherein the first via-holeconductor is spaced apart from the first portion of the second of theinsulating layers that contains the second capacitor conductor in adirection that is perpendicular to the lamination direction.
 3. Theelectronic component according to claim 1, wherein the second portion ofthe second of the insulating layers that does not contain the secondcapacitor conductor is located at an outer portion of the second of theinsulating layers.
 4. The electronic component according to claim 1,wherein the second of the insulating layers is rectangular orsubstantially rectangular.
 5. The electronic component according toclaim 1, wherein the second capacitor conductor is rectangular orsubstantially rectangular and includes a recessed portion thatcorresponds to a location of the second portion of the second of theinsulating layers that does not contain the second capacitor conductor.6. The electronic component according to claim 1, wherein no conductorlayer is provided between the land electrode and the first capacitorconductor.
 7. The electronic component according to claim 1, wherein thesecond capacitor conductor is a ground conductor.
 8. The electroniccomponent according to claim 1, further comprising a second via-holeconductor connecting the land electrode to the first capacitorconductor.
 9. An electronic component comprising: a laminate including aplurality of insulating layers laminated on each other in a laminationdirection; a land electrode provided at a lower portion of the laminate;a first capacitor conductor facing the land electrode with a first ofthe insulating layers disposed between the first capacitor conductor andthe land electrode; a second capacitor conductor provided above thefirst capacitor conductor in the lamination direction and facing thefirst capacitor conductor with a second of the insulating layersdisposed between the second capacitor conductor and the first capacitorconductor; a third capacitor conductor provided above the secondcapacitor conductor in the lamination direction and facing the secondcapacitor conductor with a third of the insulating layers disposedbetween the third capacitor conductor and the second capacitorconductor; and a first via-hole conductor connecting the first capacitorconductor to the third capacitor conductor; wherein the second capacitorconductor is rectangular or substantially rectangular and includes arecessed portion that corresponds to a location of a first portion ofthe second of the insulating layers that does not contain the secondcapacitor conductor; the first via-hole conductor extends through thefirst portion of the second of the insulating layers that does notcontain the second capacitor conductor; the recessed portion is recessedinwardly from an edge of the second capacitor conductor toward a centerof the second capacitor conductor by a distance extending in a firstdirection that is larger than a width extending in the first directionof the third capacitor conductor; a width extending in the firstdirection of a portion of the second capacitor conductor disposedadjacent to the recessed portion in the first direction is larger thanthe distance by which the recessed portion is recessed.
 10. Theelectronic component according to claim 9, wherein the first via-holeconductor is spaced apart from a second portion of the second of theinsulating layers that contains the second capacitor conductor in adirection that is perpendicular to the lamination direction.
 11. Theelectronic component according to claim 9, wherein the first portion ofthe second of the insulating layers that does not contain the secondcapacitor conductor is located at an outer portion of the second of theinsulating layers.
 12. The electronic component according to claim 9,wherein the second of the insulating layers is rectangular orsubstantially rectangular.
 13. The electronic component according toclaim 9, wherein no conductor layer is provided between the landelectrode and the first capacitor conductor.
 14. The electroniccomponent according to claim 9, wherein the second capacitor conductoris a ground conductor.
 15. The electronic component according to claim9, further comprising a second via-hole conductor connecting the landelectrode to the first capacitor conductor.
 16. An electronic componentcomprising: a laminate including a plurality of insulating layerslaminated on each other in a lamination direction; a land electrodeprovided at a lower portion of the laminate; a first capacitor conductorfacing the land electrode with a first of the insulating layers disposedbetween the first capacitor conductor and the land electrode; a secondcapacitor conductor provided above the first capacitor conductor in thelamination direction and facing the first capacitor conductor with asecond of the insulating layers on which the second capacitor conductoris located disposed between the second capacitor conductor and the firstcapacitor conductor; a third capacitor conductor provided above thesecond capacitor conductor in the lamination direction and facing thesecond capacitor conductor with a third of the insulating layersdisposed between the third capacitor conductor and the second capacitorconductor; and a first via-hole conductor connecting the first capacitorconductor to the third capacitor conductor; wherein the first via-holeconductor extends from the first capacitor conductor to the thirdcapacitor conductor through a portion of the second of the insulatinglayers that does not contain the second capacitor conductor; a dimensionof the second of the insulating layers extends from an outer edge of thesecond of the insulating layers to an edge of the second capacitorconductor, extends completely across the third capacitor conductor, andextends in a first direction; and the dimension is larger than a widthextending in the first direction of the third capacitor conductor andsmaller than a width extending in the first direction of a portion ofthe second capacitor conductor disposed adjacent to the portion of thesecond of the insulating layers in the first direction.
 17. Theelectronic component according to claim 16, wherein the portion of thesecond of the insulating layers that does not contain the secondcapacitor conductor through which the first via-hole conductor extendsis a located at an outer portion of the second of the insulating layers.18. The electronic component according to claim 16, wherein the portionof the second of the insulating layers that does not contain the secondcapacitor conductor through which the first via-hole conductor extendsis adjacent to the second capacitor conductor on at least two sidesthereof.
 19. The electronic component according to claim 16, wherein theportion of the second of the insulating layers that does not contain thesecond capacitor conductor through which the first via-hole conductorextends is spaced apart from the second capacitor conductor in adirection that is perpendicular to the lamination direction.
 20. Theelectronic component according to claim 16, wherein the second capacitorconductor is rectangular or substantially rectangular and includes arecessed portion that corresponds to a location of the portion of thesecond of the insulating layers that does not contain the secondcapacitor conductor.
 21. The electronic component according to claim 16,wherein the portion of the second of the insulating layers that does notcontain the second capacitor conductor is larger than another portion ofthe second of the insulating layers that does not contain the secondcapacitor conductor.